PVD is the abbreviation of Physical Vapor Deposition (Physical Vapor Deposition). It refers to the practice of using low-voltage and high-current arc discharge technology to vaporize the target material and ionize both the evaporated material and gas under vacuum conditions. By using the acceleration of electric field, the evaporated material and its reaction products are deposited on the workpiece.

PVD (physical vapor deposition) technology is mainly divided into three types: vacuum evaporation coating, vacuum sputtering coating and vacuum ion coating.